In wafer manufacturing, where cleanliness requirements for high-purity delivery pipelines are extremely stringent, metal ion leaching and particle release are the two most core metrics. After multiple rounds of validation testing, BSL (Baoshili) Ultra-Clean PFA Tube delivers stable and exceptional performance, with all key indicators reaching international first-tier levels and meeting the requirements of advanced process nodes.

In the metal ion leaching validation test, BSL laboratories simulated extreme test conditions: 7 consecutive days of static immersion in 37% HCl solution at a constant temperature of 85°C. Results showed that the leaching levels of key ions including Na, Al and Fe were far lower than those of comparable international brand products. The synergy between ultra-clean resin raw materials and high-temperature melt extrusion process suppresses impurity introduction from the production source, building a robust cleanliness barrier for advanced chip manufacturing.

Meanwhile, in the particle test conducted via ultrapure water (UPW) circulation flushing, the particle count of the Ultra-Clean PFA Tube was significantly lower than that of international first-tier products. Particularly in the critical particle size range of ≥0.2μm, the particle count was nearly zero. Leveraging proprietary process technology, BSL Ultra-Clean PFA Tube achieves a lower surface roughness (Ra value) and a smoother inner wall, physically reducing particle retention and adsorption at the root cause.